SK Hynix’s first “High-K EMC*” DRAM

Seoul, South Korea, August 28, 2025 – SK hynix Inc. (or “the Company”, https://www.skhynix.com) announced today that it has developed and begun supplying the industry’s first high-efficiency, heat-dissipating mobile DRAM products utilizing “High-K EMC*” materials.

*EMC (Epoxy Molding Compound): An essential material in semiconductor post-processing, used to seal and protect semiconductors from external environmental influences such as moisture, heat, shock, and static electricity, while also serving as a heat dissipation channel. High-K EMC refers to the use of materials with higher thermal conductivity (K value) in EMC, thereby improving thermal conductivity*.

*Thermal conductivity: A physical property of a material’s ability to conduct heat, specifically the amount of heat transferred through a specific material per unit time.

The company stated, “As heat generation caused by high-speed data processing during on-device AI operations becomes increasingly severe, it has become a major cause of smartphone performance degradation. This product effectively addresses the heat generation issues in high-performance flagship phones and has received high praise from customers worldwide.”

Currently, most of the latest flagship phones use a PoP (Package on Package) architecture, in which DRAM is vertically stacked on top of an application processor (Application Processor). While this architecture efficiently utilizes limited space and improves data processing speed, it also causes heat generated by the application processor to accumulate within the DRAM, impacting overall device performance.

*PoP (Package on Package): A stacked packaging method commonly used in mobile devices, vertically stacking different types of semiconductor packages to improve space utilization, performance, and packaging flexibility.