MT25QU256ABA1EW9-0SIT

MT25QU256ABA1EW9-0SIT

Part Number: MT25QU256ABA1EW9-0SIT
Product Classification: Current Sense Transformers
Manufacturer: Aeris
Description: FLASH - NOR Memory IC 256Mbit SPI - Quad I/O 133 MHz 8-WPDFN (8x6) (MLP8)
Packaging: -
ROHS Status: No
Currency: USD
PDF: Documents

• SPI-compatible serial bus interface
• Single and double transfer rate (STR/DTR)
• Clock frequency
- 166 MHz (MAX) for all protocols in STR
- 90 MHz (MAX) for all protocols in DTR
• Dual/quad I/O commands for increased
throughput up to 90 MB/s
• Supported protocols in both STR and DTR
- Extended I/O protocol
- Dual I/O protocol
- Quad I/O protocol
• Execute-in-place (XIP)
• PROGRAM/ERASE SUSPEND operations
• Volatile and nonvolatile configuration settings
• Software reset
• Additional reset pin for selected part numbers
• 3-byte and 4-byte address modes: enable memory
access beyond 128Mb
• Dedicated 64-byte OTP area outside main memory
- Readable and user-lockable
- Permanent lock with PROGRAM OTP command
• Erase capability
- Bulk erase
- Sector erase 64KB uniform granularity
- Subsector erase 4KB, 32KB granularity
• Erase performance: 400KB/sec (64KB sector)
• Erase performance: 80KB/sec (4KB sub-sector)
• Program performance: 2MB/sec
• Security and write protection
- Volatile and nonvolatile locking and software
write protection for each 64KB sector
- Nonvolatile configuration locking
- Password protection
- Hardware write protection: nonvolatile bits
(BP[3:0] and TB) define protected area size
- Program/erase protection during power-up
- CRC detects accidental changes to raw data
• Electronic signature
-JEDEC-standard 3-byte signature (BB19h)
- Extended device ID: two additional bytes identify
device factory options
• JESD47H-compliant
- Minimum 100,000 ERASE cycles per sector
- Data retention: 20 years (TYP)

• Voltage
- 1.7–2.0V U
• Density
- 256Mb 256
• Device stacking
- Monolithic A
• Device generation B
• Die revision A
• Pin configuration
- RESET# and HOLD# 8
• Sector Size
- 64KB E
• Packages – JEDEC-standard, RoHScompliant
- 24-ball T-PBGA 05/6mm x 8mm
(5 x 5 array)
12
- Wafer level chip-scale package,
23 balls, 9 active balls (XFWLBGA
0.5P)
55
- 16-pin SOP2, 300 mils
(S016W, S016-Wide, SOIC-16)
SF
- W-PDFN-8 6mm x 5mm
(MLP8 6mm x 5mm)
W7
- W-PDFN-8 8mm x 6mm
(MLP8 8mm x 6mm)
W9
• Security features
- Standard security 0
- Advanced security 1
- RPMC enabled M
• Special options
- Standard S
- Automotive A
• Operating temperature range
- From –40°C to +85°C IT
- From –40°C to +105°C AT
- From –40°C to +125°C UT

Specification