741C083101JP

 AEC-Q200 Compliant [See Ordering Information]
 Low Cost Thick Film Technology
 Leadless Surface Mount Construction
 Concave or Convex Terminations
 Solder Coated Nickel Barrier Pads
 Isolated and Bussed Circuit Configurations
 Improved TCR Tracking vs. Discrete Resistors
 Fewer Placements Than Discrete Components
 Tape and Reel Packaging